Simon X. Yang
Henry Leung
Anand Nayyar
Danilo Avola
Michele Fiorini
Welcome to the official website of the 2nd International Conference on Mechatronics and Mechanical Engineering (ICMME2023). ICMME2023 aims to provide a stimulating forum for researchers, scientists, and engineers to present their latest research findings, developments and applications in all aspects of mechatronics and mechanical engineering. It is organized by International Association of Applied Science and Technology (IAAST) and will be held during May 20-22, 2023.
We welcome author submission of papers concerning any branch of mechatronics, mechanical engineering and other related subjects. Looking forward to meeting you in Kaifeng, China. (read more)
Topics include but are not limited to: 1. Mechanical Engineering; 2. Mechatronics Technology.
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Please submit your completed manuscript to the conference email address: icmme@iaast.cn
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Organization of ICMME2023.
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Download the template and prepare your paper according to it.
→ Click to viewICMME2023 welcomes author submission of original and significant contributions. Each submission is anonymously reviewed by an average of three independent reviewers, to ensure the final high standard and quality of submitted papers. All accepted papers will be published in conference proceedings and sent to EI Compendex, Scopus for indexing service.
Submission Deadline
Notification of Acceptance
Camera Ready Submission
Registration Deadline
ICMME2023 follows the highest standards of publication ethics and takes all possible procedures against any publication misconduct. This Conference does not accept any type of plagiarism, which means that any author replicating a significant part of another's work without acknowledging him/her or passing another's work off as his/her own are not tolerated and not published.
All authors submitting their works to ICMME2023 for publication as original works confirm that the submitted papers are their own contributions and have not been copied in whole or in part from other works. (read more)
